| 【文章摘要】 Thanks to their exceptional thermal and electrical properties, borosilicate glasses are widely used in chip packaging and electronic pastes. Nonetheless, borosilicate glass powders suffer from the phenomenon of foaming and expansion during sintering process, which greatly affects the sintering densities of the powders and poses limitations to their applications. Herein, we explored the foaming mechanism of borosilicate glasses by ball milling. The foaming of borosilicate glass is due to the adsorption of CO_2 from the atmosphere by the glass powder during ball milling. The CO_2 forms carbonates on the surface of the glass powder and is released during the sintering process, leading to foaming. Additionally, as the specific surface area of the glass powder increases, its corrosion resistance decreases while its foaming strength increases. The foaming strength of the four glass powders, listed in ascending order, is: SrO-B_2O_3-SiO_2, ZnO-B_2O_3-SiO_2, BaO-B_2O_3-SiO_2 and CaO-B_2O_3-SiO_2. Meanwhile, it was found that the foaming strength could be weakened better by ball milling organic modification method. These findings contribute to a deeper understanding of the glass foaming phenomenon. Furthermore, they offer practical strategies to reduce the foaming and optimize the performance of borosilicate glass-based materials in applications of chip packaging and electronic pastes. |